01Material analysis lab
Formulation evaluation across resin, fillers, slurry behavior and film results.
About
About Yipengchunhui
Shenzhen Yipengchunhui Technology develops and manufactures integrated-circuit composite materials for package substrates, advanced packaging, flexible circuits and high-thermal applications.
R&D / Manufacturing Gallery
R&D, process and material samples in one continuous view
The about page now presents lab, cleanroom, coating equipment and product samples as a smooth swipeable gallery so visitors can understand capability faster.
01
02Experimental validation
Sample preparation and testing feedback support fast iteration and tailored development.
03Cleanroom production
Cleanroom control reduces particle and appearance risks in film materials.
04Roll-to-roll precision coating
The process focuses on coating uniformity, thickness accuracy and winding stability.
05Film material sample
New product imagery shows the real form of IC composite materials.
Facility
From molecular design to scalable production, we build a complete materials platform.
— 01 Research
Science-drivenmaterials innovation
Our R&D platform links molecular design, powder modification, slurry compounding and precision coating into one integrated development chain.
We continuously tune resin systems, inorganic fillers, interfaces and film-forming processes to balance dielectric, thermal, mechanical and manufacturing requirements.
— 02 Manufacturing
Cleanroomprecision coating
Our production capability includes Class 10,000 cleanroom control and roll-to-roll precision coating for film uniformity and thickness stability.
Process controls cover incoming materials, mixing, filtration, coating, curing, slitting and packaging to support sample evaluation and volume delivery.
Mission
Enable new possibilities in chip technology through materials innovation.
Vision
Become a trusted global partner for critical semiconductor materials.
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