01
Application structure
Package substrates, HDI/SLP, flexible circuits, thermally conductive insulation and functional coatings require different material forms and evaluation priorities.
Products
An IC composite materials portfoliofor packaging, interconnect and functional coatings
The portfolio covers package substrate films, resin coated copper, flexible composite films, specialty functional films and electronic pastes. ABF-type build-up materials are one branch within the package-substrate route.
Selection Path
Application structure defines the material route
Yipengchunhui supports material selection through application structure, key data, process windows and sample validation.
02
Key data ranges
Thickness, Tg, Df, CTE, thermal conductivity and adhesion define the initial material boundary.
03
Check the process window
Evaluate lamination, laser drilling, plating, reflow and reliability conditions together.
04
Sample validation
Validate the material against the customer's real stack-up, target process and reliability requirements.
Application Map
Select the material form from the application structure
AEM is built on an IC composite materials platform covering package substrates, PCB, SLP, embedded structures, RDL, molding, die bonding and functional paste applications.
Application
Material route
Selection basis
01
Package substrate / FC-BGA / ABF-type structures
F / RC series
SAP, microvias, fine lines, high Tg and low CTE.
02
PCB / HDI / SLP
RC / F series
Compatible with horizontal desmear and conventional lamination.
03
Embedded boards / capacitors
F / RC series
For power devices, passive embedding and thin dielectric layers.
04
Advanced packaging RDL
Ultra-thin F / RC films
For FOPLP, WLP, 2.5D RDL layers and fine-line build-up.
05
Molding / power packaging
TC series
Low CTE, thermal insulation and thick-film build-up for MIS, ETS and FOPLP.
06
Die bonding / buffer cover
CL series
High adhesion, low moisture uptake and flexible cured film.
07
Functional coating / paste
RP series
Screen printing or brushing for insulation protection and functional paste layers.
08
Inductors / components
CL / RP series
For bonding, insulation protection and long-term reliability.
Material Workflow
From material design to manufacturing and application validation
Films, copper-clad forms, flexible composites and pastes are developed around real process introduction, balancing material performance, process windows and reliability.
01Formulation and sample evaluation
Material design starts from resin chemistry, filler dispersion and target dielectric or thermomechanical behavior.
02Precision coating and paste control
Dispersion, coating, drying, winding and paste solid content control stabilize appearance, thickness and batch consistency.
03Application-driven material matching
Package substrates, HDI, flexible circuits, thermal-management structures and functional coatings correspond to different material series.
Packaging Dielectric Film
F Series · Packaging Dielectric Film
For FC-BGA, Chiplet and AI server package substrates.
Application fit
For build-up insulation, fine-line formation and reliable package substrate stack-ups.
Selection focus
Focus on low loss, low CTE, Tg, thickness uniformity and SAP/semi-additive process windows.
Evaluation notes
Evaluate target line/space, dielectric thickness, laser drilling, copper plating and reflow reliability together.
Thickness range
10~100 μm
Tg range
175~202 ℃
Df @5GHz
0.0045~0.018
CTE range
19~40 ppm/K
F100 Packaging Dielectric Film
Standard F-series film for package substrates, balancing insulation reliability and process adaptability.
View key data
F200 Low-CTE Packaging Film
Low-CTE grade for package substrate designs that require improved dimensional stability.
View key data
F300 High-Frequency Low-Loss Film
Low-loss, high-Tg film for high-speed interconnect and advanced package substrate evaluation.
View key data
F400 Ultra-Low-Loss Film
Ultra-low-loss grade for demanding AI server, 5G/6G and high-bandwidth interconnect applications.
View key data
AEM-F305A Build-up Film
Thermoset insulating film for SAP package substrates with L/S down to 25/25 μm.
View key data
Resin Coated Copper
RC Series · Resin Coated Copper
For HDI, SLP, copper filling, embedded devices and conventional lamination processes.
Application fit
For HDI, SLP and build-up structures that need copper-clad film introduction.
Selection focus
Focus on copper foil compatibility, filling behavior, lamination window, dimensional stability and high-frequency loss.
Evaluation notes
Clarify copper foil type, lamination conditions, via structure, filling depth and surface treatment requirements.
Thickness range
10~100 μm
Tg range
175~200 ℃
Df @5GHz
0.0045~0.018
CTE range
20~37 ppm/K
RC10 Resin Coated Copper Film
Standard RCC grade for HDI and rigid PCB processes requiring filling capability and insulation reliability.
View key data
RC20 Low-CTE RCC Film
RCC grade with improved dimensional stability and lower dielectric loss for advanced HDI structures.
View key data
RC30 High-Frequency RCC Film
High-frequency RCC grade combining low loss, heat resistance and mechanical stability.
View key data
RC40 Ultra-Low-Loss RCC Film
Ultra-low-loss RCC grade for high-end copper foil systems and fine-line applications.
View key data
Flexible Laminate Film
CL Series · Flexible Laminate Film
For FPC, foldable displays, wearables and dynamic bending structures.
Application fit
For flexible circuits, wearables and dynamic bending insulation or bonding structures.
Selection focus
Focus on elongation, peel strength, heat resistance, moisture uptake and resin flow control.
Evaluation notes
Evaluate bending radius, bending cycles, copper foil structure, coverlay process and soldering temperature.
Thickness range
5~75 μm
Tg range
65~160 ℃
Df @5GHz
0.02
Peel strength
1.2~25 N/mm
CL60 Flexible Laminate Film
High-flexibility film for FPC and dynamic bending applications.
View key data
CL90 Balanced Flexible Film
Balanced flexible grade for structures that require both flexibility and heat resistance.
View key data
CL160 Heat-Resistant Flexible Film
Heat-resistant flexible film for FPC structures with higher process temperature requirements.
View key data
AEM-CL148 Flexible Film
Thermoset flexible composite film for reliable bonding, insulation protection and cured-film flexibility.
View key data
AEM-CL25J1 Flexible Film
PI-release flexible composite film for circuit insulation protection, functional layer bonding and battery module bonding.
View key data
Thermal & PLP Film
TC Series · Thermal & PLP Film
For PLP, low-warpage structures and thermally conductive insulation.
Application fit
For panel-level packaging, power devices and insulation layers requiring low CTE or thermal conductivity.
Selection focus
Focus on CTE, modulus, thermal conductivity, dielectric loss and large-area warpage control.
Evaluation notes
Evaluate chip size, package structure, thermal path, reflow conditions and reliability targets together.
Tg range
175~200 ℃
Df @5GHz
0.006~0.007
CTE range
13~14 ppm/K
Thermal conductivity
0.8~8 W/m·K
Functional Paste
RP Series · Functional Paste
For screen printing, insulation protection, conductive or insulating functional layers and bonding applications.
Application fit
For resistor protection, functional coatings, conductive or insulating paste layers and composite bonding scenarios.
Selection focus
Focus on solid content, adhesion, coating window, chemical resistance, low moisture uptake and long-term reliability.
Evaluation notes
Evaluate printing or brushing method, drying time, curing profile, substrate interface and environmental reliability together.
Solid content
35±2%
Tg range
65℃
Df @5GHz
0.02
Peel strength
1.4 N/mm