Recommended use
The F series supports FC-BGA, Chiplet and AI server package substrates, from standard insulation to low-loss and low-CTE stack-ups.
F · Series · Packaging Dielectric
F300 High-Frequency Low-Loss Film
Low-loss, high-Tg film for high-speed interconnect and advanced package substrate evaluation.
10~100 μm
Thickness range
175~202 ℃
Tg range
0.0045~0.018
Df @5GHz
Product Position
A base material platform for package substrate build-up insulation
The F series supports FC-BGA, Chiplet and AI server package substrates, from standard insulation to low-loss and low-CTE stack-ups.
Process evaluation
Evaluation should cover lamination flow, laser drilling, copper plating adhesion, reflow resistance and insulation reliability after humidity stress.
Series logic
Evaluation should cover lamination flow, laser drilling, copper plating adhesion, reflow resistance and insulation reliability after humidity stress.
Inputs to prepare
Target dielectric thickness / Line/space and layer count / Lamination and reflow conditions
Key Data
Key data ranges
Detailed process conditions, test methods and full parameter items should be confirmed during sample evaluation.
Thickness range
10~100 μm
Tg range
175~202 ℃
Df @5GHz
0.0045~0.018
CTE range
19~40 ppm/K
* Values are indicative key ranges. Full test items, conditions, sample batches and process environments should be confirmed through sample evaluation and formal documents.
Same Series
F · Series
F100
Packaging Dielectric Film
Standard F-series film for package substrates, balancing insulation reliability and process adaptability.
View key data
F200
Low-CTE Packaging Film
Low-CTE grade for package substrate designs that require improved dimensional stability.
View key data
F400
Ultra-Low-Loss Film
Ultra-low-loss grade for demanding AI server, 5G/6G and high-bandwidth interconnect applications.
View key data