Integrated materials technology platform
Our platform combines resin design, filler dispersion, slurry compounding, precision coating and application validation for integrated-circuit composite materials.
Proprietary resin systems
Resin structures are designed around dielectric behavior, CTE, modulus and thermal resistance while balancing low loss, low moisture uptake, processability and reliability.
Filler dispersion and interface control
Powder modification, particle-size grading and coupling chemistry improve dispersion stability, reduce defect risk and strengthen thermal, dielectric and mechanical consistency.
Precision coating and validation
Roll-to-roll coating, curing and slitting controls support film thickness, surface quality and batch stability, followed by application validation in customer processes.
TC Series
key parameters
TC1700 is designed for high-performance panel-level packaging, while TC10 targets high-thermal applications. Both are compatible with sputtering processes.
| Specification | TC1700 High Performance | TC10 High Thermal |
|---|---|---|
| Melt viscosity(Melt Viscosity) | 125℃ @ 200 Pa·s | 115℃ @ 230 Pa·s |
| Glass transition temperature(Tg · DMA) | 200 ℃ | 175 ℃ |
| CTE(CTE · 30-150 ℃) | 13 ppm/K | 14 ppm/K |
| CTE(CTE · 150-240 ℃) | 47 ppm/K | 40 ppm/K |
| Young's modulus(Young's Modulus) | 10 GPa | 8 GPa |
| Breaking strength(Breaking Strength) | 120 MPa | 80 MPa |
| Dielectric constant(Dk · 5 GHz) | 3.3 | 3.5 |
| Dissipation factor(Df · 5 GHz) | 0.007 | 0.006 |
| Thermal conductivity(Thermal Conductivity) | 0.8 W/m·K | 8 W/m·K |
| Process compatibility(Process) | Sputter | Sputter |
* Values are typical test results for reference only and are not product acceptance criteria. Test conditions, sample lots and process environments may affect measured values.