01Build-up film sample
Thermoset insulating films such as AEM-F305A for SAP fine-line package substrates.
Integrated Circuit Composite Materials
IC Composite MaterialsR&D and Manufacturing Platform
Yipengchunhui builds a material development loop around resin modification, functional fillers, paste dispersion and precision coating, covering package substrate films, resin coated copper, flexible composite films, specialty functional films and electronic pastes.
Material signals
5 families
Material platform
Df 0.0045
Low-loss insulation
8 W/m·K
Thermal composite
Visual Materials
Connect material form, application and process in one visual flow
The image set uses product, application, R&D and manufacturing assets from the project folder so visitors can understand form, use case and capability before reading detailed data.
01
02Package substrate materials
F Series materials for FC-BGA, Chiplet and AI server package substrates.
03HDI / SLP interconnect
RC films support RTF / VLP copper foil, filling and lamination processes.
04Flexible electronics
CL Series materials balance bending resistance, adhesion, low moisture uptake and resin-flow control.
05R&D and material analysis
A complete development loop from resin and fillers to slurry and film-forming process.
06Roll-to-roll precision coating
Manufacturing focuses on coating uniformity, thickness control and batch consistency.
Why Composite Materials
IC composite materials are defined by multiple constraints working together, not by a single headline parameter.
01
Structures keep getting finer
Advanced packaging, HDI, SLP and RDL structures require finer lines, thinner dielectric layers and more stable interfaces. Materials must control thickness, flow, curing and reliability in one process window.
02
Signals keep getting faster
AI servers, 5G/6G and high-speed interconnects are increasingly sensitive to dielectric loss. Material selection must consider loss, moisture uptake and long-term stability at high frequency.
03
Thermal stress, warpage and interfaces are harder to control
Chiplets, PLP, power devices and flexible structures require CTE, modulus, thermal conductivity, adhesion and chemical resistance to be designed together from formulation to film process.
Material Architecture
A material platform for multiple IC applications.
ABF-type build-up material is one package-substrate route; the same technology base also supports interconnect, flexible, thermal-management and functional paste material forms.
01
Build the base from resin systems
Thermoset resins, functional fillers and interface modification are converted into package substrate films, resin coated copper, flexible composite films, functional films and electronic pastes.
02
Coordinate organic resins and inorganic fillers
Resin modification, filler surface treatment and dispersion control balance low loss, low CTE, heat resistance, modulus, flexibility, adhesion and chemical resistance in one material system.
03
Dispersion, coating and curing define production consistency
Composite materials must enter continuous customer processes, where slurry dispersion, roll-to-roll coating, staged curing, cleanroom control and inspection determine batch stability.
Product Portfolio
Five material forms for packaging, interconnect, flexible electronics and thermal management.
Package substrate films, resin coated copper, flexible composite films, specialty functional films and electronic pastes support key data review through sample validation.
F5 models · Df 0.0045
F Series · Packaging Films
FC-BGA, Chiplet and AI server package substrates
A low-CTE, low-loss and high-Tg material set for package substrates.
View Series
RC4 models · Df 0.0045
RC Series · RCC Films
HDI, SLP, thick-copper filling and embedded components
Compatible with RTF / VLP copper foil and conventional lamination processes.
View Series
CL5 models · Df 0.02
CL Series · Flexible Films
FPC, foldable displays, wearables and dynamic bending
Designed around flexibility, heat resistance, low moisture uptake and resin-flow control.
View Series
TC2 models · Df 0.006
TC Series · Functional Films
PLP, low warpage, high-thermal insulation and power devices
Covers both low-CTE and high-thermal high-constraint application windows.
View Series
RP1 models · Df 0.02
RP Series · Electronic Pastes
Screen printing, functional coatings, insulation protection and bonding
Conductive / insulating pastes and high-reliability protective coating materials.
View Series
01
Molecular design
02
Filler modification
03
Slurry dispersion
04
Precision coating
05
Staged curing
06
Reliability validation
Applications
Material combinations for real application scenarios.
Advanced packaging, HDI, flexible electronics and power devices each require different dielectric, thermomechanical, adhesion and reliability performance.
01Advanced Packaging
For FC-BGA, Chiplet and 2.5D/3D packaging with fine-line capability and high-reliability insulation.
02HDI / SLP
Compatible with RTF / VLP copper foil and lamination processes, with filling performance for build-up structures.
03Flexible Electronics
High elongation and bending resistance for foldable phones, wearables and dynamic flex applications.
04Power & Embedded Devices
High thermal conductivity and low CTE for PLP structures and high-power device thermal management.
Sample evaluation