Yipengchunhui releases next-generation IC composite materials (TC Series)

As the post-Moore era accelerates, advanced packaging technologies such as 2.5D/3D and Chiplet have become key paths for improving chip performance. Shenzhen Yipengchunhui Technology has introduced the TC Series functional film products as an important part of its integrated-circuit composite materials platform. TC1700 is designed for high-density interconnect and panel-level packaging structures, with low CTE and strong electrical insulation performance for high-computing package requirements. TC10 targets high-thermal applications with thermal conductivity reaching 8 W/m·K, providing a new material option for heat dissipation in high-power devices.