Recommended use
The CL series supports FPC, foldable displays and wearable structures, balancing flexibility, heat resistance, peel strength and resin flow.
CL · Series · Flexible Laminate
CL90 Balanced Flexible Film
Balanced flexible grade for structures that require both flexibility and heat resistance.
5~75 μm
Thickness range
65~160 ℃
Tg range
0.02
Df @5GHz
Product Position
A material platform for flexible circuits and dynamic bending
The CL series supports FPC, foldable displays and wearable structures, balancing flexibility, heat resistance, peel strength and resin flow.
Process evaluation
Evaluate bending radius, bending cycles, coverlay process, copper structure and soldering temperature to confirm long-term stability under deformation.
Series logic
Evaluate bending radius, bending cycles, coverlay process, copper structure and soldering temperature to confirm long-term stability under deformation.
Inputs to prepare
Bending radius and cycles / Copper and coverlay structure / Soldering temperature
Key Data
Key data ranges
Detailed process conditions, test methods and full parameter items should be confirmed during sample evaluation.
Thickness range
5~75 μm
Tg range
65~160 ℃
Df @5GHz
0.02
Peel strength
1.2~25 N/mm
* Values are indicative key ranges. Full test items, conditions, sample batches and process environments should be confirmed through sample evaluation and formal documents.
Same Series
CL · Series
CL60
Flexible Laminate Film
High-flexibility film for FPC and dynamic bending applications.
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CL160
Heat-Resistant Flexible Film
Heat-resistant flexible film for FPC structures with higher process temperature requirements.
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AEM-CL148
Flexible Film
Thermoset flexible composite film for reliable bonding, insulation protection and cured-film flexibility.
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