Recommended use
The TC series supports PLP, power devices and structures requiring both insulation and heat-management capability.
TC · Series · Thermal & PLP
TC1700 Low-CTE Build-up Film
Specialty build-up film for PLP structures requiring low CTE and warpage control.
175~200 ℃
Tg range
0.006~0.007
Df @5GHz
13~14 ppm/K
CTE range
Product Position
A specialty platform for low warpage and thermally conductive insulation
The TC series supports PLP, power devices and structures requiring both insulation and heat-management capability.
Process evaluation
Assess die size, package area, thermal path, reflow profile and reliability targets together, not only thermal conductivity or CTE alone.
Series logic
Assess die size, package area, thermal path, reflow profile and reliability targets together, not only thermal conductivity or CTE alone.
Inputs to prepare
Package size and structure / Target thermal path / Warpage and reliability targets
Key Data
Key data ranges
Detailed process conditions, test methods and full parameter items should be confirmed during sample evaluation.
Tg range
175~200 ℃
Df @5GHz
0.006~0.007
CTE range
13~14 ppm/K
Thermal conductivity
0.8~8 W/m·K
* Values are indicative key ranges. Full test items, conditions, sample batches and process environments should be confirmed through sample evaluation and formal documents.