Recommended use
The RP series supports screen printing, brushing, insulation protection, functional layer bonding and composite interface treatment.
RP · Series · Functional Paste
AEM-RP148 Electronic Paste
Epoxy-based composite paste for insulation protection, functional layer bonding, die buffering and battery module bonding.
35±2%
Solid content
65℃
Tg range
0.02
Df @5GHz
Product Position
A material platform for functional coatings and electronic paste processes
The RP series supports screen printing, brushing, insulation protection, functional layer bonding and composite interface treatment.
Process evaluation
Evaluate solid content, printing or brushing method, drying time, curing profile, substrate adhesion and thermal-cycle reliability together.
Series logic
Evaluate solid content, printing or brushing method, drying time, curing profile, substrate adhesion and thermal-cycle reliability together.
Inputs to prepare
Coating or printing method / Substrate and surface treatment / Drying and curing conditions
Key Data
Key data ranges
Detailed process conditions, test methods and full parameter items should be confirmed during sample evaluation.
Solid content
35±2%
Tg range
65℃
Df @5GHz
0.02
Peel strength
1.4 N/mm
* Values are indicative key ranges. Full test items, conditions, sample batches and process environments should be confirmed through sample evaluation and formal documents.