Recommended use
The RC series supports HDI, SLP, copper filling and embedded-device structures while fitting into conventional lamination workflows.
RC · Series · Resin Coated Copper
RC40 Ultra-Low-Loss RCC Film
Ultra-low-loss RCC grade for high-end copper foil systems and fine-line applications.
10~100 μm
Thickness range
175~200 ℃
Tg range
0.0045~0.018
Df @5GHz
Product Position
A material platform for RCC introduction and HDI/SLP processes
The RC series supports HDI, SLP, copper filling and embedded-device structures while fitting into conventional lamination workflows.
Process evaluation
Clarify copper foil type, via structure, lamination window, filling depth and surface treatment before comparing single-point electrical data.
Series logic
Clarify copper foil type, via structure, lamination window, filling depth and surface treatment before comparing single-point electrical data.
Inputs to prepare
Copper foil type and thickness / Via diameter and depth / Lamination and surface-treatment conditions
Key Data
Key data ranges
Detailed process conditions, test methods and full parameter items should be confirmed during sample evaluation.
Thickness range
10~100 μm
Tg range
175~200 ℃
Df @5GHz
0.0045~0.018
CTE range
20~37 ppm/K
* Values are indicative key ranges. Full test items, conditions, sample batches and process environments should be confirmed through sample evaluation and formal documents.
Same Series
RC · Series
RC10
Resin Coated Copper Film
Standard RCC grade for HDI and rigid PCB processes requiring filling capability and insulation reliability.
View key data
RC20
Low-CTE RCC Film
RCC grade with improved dimensional stability and lower dielectric loss for advanced HDI structures.
View key data
RC30
High-Frequency RCC Film
High-frequency RCC grade combining low loss, heat resistance and mechanical stability.
View key data